Electroless plating of solid metals from a solution has been widely used in the printed circuit board industry for production of wiring layers and inter-layer (via) connections and more recently for the production of metal interconnect films in the integrated circuit substrate (IC substrate) industry.  As applications move to more flexible and portable devices, the need to apply the electroless plating body of knowledge to new substrates is great. DOW-MI is working on the development of a water soluble, dual-functional polymer for adhesion promotion between copper and flexible substrates and the planarization of copper in electroless copper plating

 

Project 6 Members

Rachel Segalman	UCSB	Principle Investigator
Mingqi Li	Dow	Project Manager
Peter Trefonas	Dow	Technical Liaison
Hellen Papananou	UCSB	Postdoctoral Scholar